3D embossing is the three-dimensional shaping of paper or cardboard. For this purpose, the flat material is pressed between 2 tools, namely the embossing die and the counter mold, and thus deformed. The embossing can be seen on both sides of the paper.

Types of 3D embossing

The quality of the tools determines the result:

• If the motif is raised, it is referred to as embossing
• If the motif is recessed, it is referred to as deep embossing
• A single-level embossing has a raised or recessed level.
• Multi-level embossing has two or more levels parallel to the paper surface.
• Sculptured 3D relief embossing, on the other hand, shows three-dimensional gradients and body shapes, such as a face or a statue.

A more historical term for 3D embossing is “blind embossing“. The name indicates the positioning in an unprinted area of the paper. However, the term lacks a more precise definition, such as whether raised or recessed is desired.

Optical reinforcement of 3D embossing

Additional light reflection greatly enhances the visual effect of embossing. There are two options for this:

1. Metallization of the embossed motif with a wafer-thin layer of reflective metal, a so-called foil relief embossing
2. High-gloss UV varnishing of the embossed motif, a so-called varnish embossing or varnish deep embossing.

Formats and thicknesses for 3D embossing

With us you can have business cards embossed from business card size up to sheet format 720×1,020mm.

Paper and cardboard can be embossed well up to around 450g/m². With thick cardboard and paperboard, the material is often too thick for deformation. However, a well palpable recess can usually be pressed in here.

Thin papers, on the other hand, often have too little body for an effective result. Here it is better to work with thick-layer relief varnish instead of embossing.

Tricks and tips for 3D embossing

Although embossing sounds very simple at first glance, a few points are crucial to success right from the design phase. You can find important tips from us on this page: 3D embossing